Have a personal or library account? Click to login
Analysis of the temperature distribution in an SIP building envelope Cover

Analysis of the temperature distribution in an SIP building envelope

Open Access
|Dec 2025

Figures & Tables

Fig. 1.

Multi-layer SIP (own research)
Multi-layer SIP (own research)

Fig. 2.

Arrangement of the sensors in the tested envelopes (own research)
Arrangement of the sensors in the tested envelopes (own research)

Fig. 3.

Measuring probe design details (own research)
Measuring probe design details (own research)

Fig. 4.

Temperature changes inside the two-layer envelope (A) and inside the SIP (B) over the analysed period of time (own research)
Temperature changes inside the two-layer envelope (A) and inside the SIP (B) over the analysed period of time (own research)

Fig. 5.

24-hour temperature distribution in the two-layer envelope (A) and in the SIP (B) (own research)
24-hour temperature distribution in the two-layer envelope (A) and in the SIP (B) (own research)

Fig. 6.

Comparison of the temperature distribution in the two-layer envelope and in the SIP in selected measuring points (own research)
Comparison of the temperature distribution in the two-layer envelope and in the SIP in selected measuring points (own research)

Fig. 7.

Comparison of temperature in the two-layer envelope and in the SIP at selected measuring points (own research)
Comparison of temperature in the two-layer envelope and in the SIP at selected measuring points (own research)

24-hour thermal resistance values for the points in the two-layer envelope and in the SIP (own research)

Thermal resistance R [m2K/W]
two-layer wall (A)SIP (B)
A1A2A3A4A5B1B2B3B4B5
0.0512.4204.7885.7116.7741.1333.2384.5547.71210.646
DOI: https://doi.org/10.17512/bozpe.2025.14.25 | Journal eISSN: 2544-963X | Journal ISSN: 2299-8535
Language: English
Page range: 255 - 263
Published on: Dec 12, 2025
Published by: Technical University in Czestochowa
In partnership with: Paradigm Publishing Services
Publication frequency: 1 issue per year

© 2025 Anna Satława, Maciej Famulok, Mateusz Płonka, Janusz Juraszek, published by Technical University in Czestochowa
This work is licensed under the Creative Commons Attribution-ShareAlike 4.0 License.