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Analysis of the temperature distribution in an SIP building envelope Cover

Analysis of the temperature distribution in an SIP building envelope

Construction of Optimized Energy Potential
Volume 14 (2025): Issue 1 (December 2025)
By: Anna Satława,  Maciej Famulok,  Mateusz Płonka and  Janusz Juraszek  
Open Access
|Dec 2025

Authors

Anna Satława

satlawa44@gmail.com

University of Bielsko-Biala, Poland

Maciej Famulok

University of Bielsko-Biala, Poland

Mateusz Płonka

University of Bielsko-Biala, Poland

Janusz Juraszek

University of Bielsko-Biala, Poland
DOI: https://doi.org/10.17512/bozpe.2025.14.25 | Journal eISSN: 2544-963X | Journal ISSN: 2299-8535
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Language: English
Page range: 255 - 263
Published on: Dec 12, 2025
Published by: Technical University in Czestochowa
In partnership with: Paradigm Publishing Services
Publication frequency: 1 issue per year
Keywords:
FBG temperature sensors,
temperature distribution,
thermo-modernization,
structural insulated panel (SIP)
Related subjects:
Architecture and design,
Architecture and design, other,
Engineering,
Civil engineering,
Materials,
Environmental engineering

© 2025 Anna Satława, Maciej Famulok, Mateusz Płonka, Janusz Juraszek, published by Technical University in Czestochowa
This work is licensed under the Creative Commons Attribution-ShareAlike 4.0 License.

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