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Analysis of the temperature distribution in an SIP building envelope Cover

Analysis of the temperature distribution in an SIP building envelope

Open Access
|Dec 2025

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DOI: https://doi.org/10.17512/bozpe.2025.14.25 | Journal eISSN: 2544-963X | Journal ISSN: 2299-8535
Language: English
Page range: 255 - 263
Published on: Dec 12, 2025
Published by: Technical University in Czestochowa
In partnership with: Paradigm Publishing Services
Publication frequency: 1 issue per year

© 2025 Anna Satława, Maciej Famulok, Mateusz Płonka, Janusz Juraszek, published by Technical University in Czestochowa
This work is licensed under the Creative Commons Attribution-ShareAlike 4.0 License.