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Innovative Devops for Artificial Intelligence Cover

Innovative Devops for Artificial Intelligence

The Scientific Bulletin of Electrical Engineering Faculty
Volume 19 (2019): Issue 1 (April 2019)
By: R. Ciucu,  F.C. Adochiei,  Ioana-Raluca Adochiei,  F. Argatu,  G.C. Seriţan,  B. Enache,  S. Grigorescu and  Violeta Vasilica Argatu  
Open Access
|May 2019

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DOI: https://doi.org/10.1515/sbeef-2019-0011 | Journal eISSN: 2286-2455 | Journal ISSN: 1843-6188
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Language: English
Page range: 58 - 63
Published on: May 4, 2019
Published by: Valahia University of Targoviste
In partnership with: Paradigm Publishing Services
Publication frequency: 2 issues per year
Keywords:
Artificial Intelligence,
HPC,
Clustering,
PAAS,
Orchestration,
DevOps,
Related subjects:
Engineering,
Electrical engineering,
Fundamentals of electrical engineering,
Bioengineering and biomedical engineering,
Biomedical electronics

© 2019 R. Ciucu, F.C. Adochiei, Ioana-Raluca Adochiei, F. Argatu, G.C. Seriţan, B. Enache, S. Grigorescu, Violeta Vasilica Argatu, published by Valahia University of Targoviste
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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