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Innovative Devops for Artificial Intelligence Cover

Innovative Devops for Artificial Intelligence

The Scientific Bulletin of Electrical Engineering Faculty
Volume 19 (2019): Issue 1 (April 2019)
By: R. Ciucu,  F.C. Adochiei,  Ioana-Raluca Adochiei,  F. Argatu,  G.C. Seriţan,  B. Enache,  S. Grigorescu and  Violeta Vasilica Argatu  
Open Access
|May 2019

Authors

R. Ciucu

University POLITEHNICA of Bucharest, Romania

F.C. Adochiei

felix.adochiei@upb.ro

University POLITEHNICA of Bucharest, Romania

Ioana-Raluca Adochiei

Technical Military Academy “Ferdinand I”, Bucharest, Romania

F. Argatu

University POLITEHNICA of Bucharest, Romania

G.C. Seriţan

University POLITEHNICA of Bucharest, Romania

B. Enache

University POLITEHNICA of Bucharest, Romania

S. Grigorescu

University POLITEHNICA of Bucharest, Romania

Violeta Vasilica Argatu

University POLITEHNICA of Bucharest, Romania
DOI: https://doi.org/10.1515/sbeef-2019-0011 | Journal eISSN: 2286-2455 | Journal ISSN: 1843-6188
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Language: English
Page range: 58 - 63
Published on: May 4, 2019
Published by: Valahia University of Targoviste
In partnership with: Paradigm Publishing Services
Publication frequency: 2 issues per year
Keywords:
Artificial Intelligence,
HPC,
Clustering,
PAAS,
Orchestration,
DevOps,
Related subjects:
Engineering,
Electrical engineering,
Fundamentals of electrical engineering,
Bioengineering and biomedical engineering,
Biomedical electronics

© 2019 R. Ciucu, F.C. Adochiei, Ioana-Raluca Adochiei, F. Argatu, G.C. Seriţan, B. Enache, S. Grigorescu, Violeta Vasilica Argatu, published by Valahia University of Targoviste
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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