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Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 & SAC405) Cover

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Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 & SAC405)

Powder Metallurgy Progress

Volume 18 (2018): Issue 1 (June 2018)

By: P. Manoj Kumar, G. Gergely, D. K. Horváth and Z. Gácsi

Open Access

|Jul 2018

Articles in this issue

DOI: https://doi.org/10.1515/pmp-2018-0006 | Journal eISSN: 1339-4533 | Journal ISSN: 1335-8987

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Language: English

Page range: 49 - 57

Published on: Jul 25, 2018

Published by: Slovak Academy of Sciences, Institute of Materials Research

In partnership with: Paradigm Publishing Services

Publication frequency: 2 issues per year

Keywords:

Lead-free solder,

Sn–Ag–Cu alloys,

Microstructure,

Mechanical properties

Related subjects:

Mechanical engineering,

Fundamentals of mechanical engineering,

Bioengineering and biomedical engineering,

Biomedical electronics,

Materials sciences,

Materials sciences, other

© 2018 P. Manoj Kumar, G. Gergely, D. K. Horváth, Z. Gácsi, published by Slovak Academy of Sciences, Institute of Materials Research
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

Volume 18 (2018): Issue 1 (June 2018)

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