Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 & SAC405)
By: P. Manoj Kumar, G. Gergely, D. K. Horváth and Z. Gácsi
Authors
P. Manoj Kumar
Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc, Hungary
G. Gergely
Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc, Hungary
D. K. Horváth
Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc, Hungary
Z. Gácsi
Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc, Hungary
Language: English
Page range: 49 - 57
Published on: Jul 25, 2018
In partnership with: Paradigm Publishing Services
Publication frequency: 2 issues per year
Related subjects:
© 2018 P. Manoj Kumar, G. Gergely, D. K. Horváth, Z. Gácsi, published by Slovak Academy of Sciences, Institute of Materials Research
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.