Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 &amp; SAC405)

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Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 & SAC405)

Open Access

|Jul 2018

Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc, Hungary

Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc, Hungary

Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc, Hungary

Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc, Hungary

DOI: https://doi.org/10.1515/pmp-2018-0006 | Journal eISSN: 1339-4533 | Journal ISSN: 1335-8987

Language: English

Page range: 49 - 57

Published on: Jul 25, 2018

In partnership with: Paradigm Publishing Services

Publication frequency: 2 issues per year

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© 2018 P. Manoj Kumar, G. Gergely, D. K. Horváth, Z. Gácsi, published by Slovak Academy of Sciences, Institute of Materials Research
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.