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Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 & SAC405) Cover

Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 & SAC405)

Powder Metallurgy Progress
Volume 18 (2018): Issue 1 (June 2018)
By: P. Manoj Kumar,  G. Gergely,  D. K. Horváth and  Z. Gácsi  
Open Access
|Jul 2018
DOI: https://doi.org/10.1515/pmp-2018-0006 | Journal eISSN: 1339-4533 | Journal ISSN: 1335-8987
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Language: English
Page range: 49 - 57
Published on: Jul 25, 2018
Published by: Slovak Academy of Sciences, Institute of Materials Research
In partnership with: Paradigm Publishing Services
Publication frequency: 2 issues per year
Keywords:
Lead-free solder,
Sn–Ag–Cu alloys,
Microstructure,
Mechanical properties
Related subjects:
Engineering,
Mechanical engineering,
Fundamentals of mechanical engineering,
Bioengineering and biomedical engineering,
Biomedical electronics,
Materials sciences,
Materials sciences, other

© 2018 P. Manoj Kumar, G. Gergely, D. K. Horváth, Z. Gácsi, published by Slovak Academy of Sciences, Institute of Materials Research
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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