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Sensitivity Jump of Micro Accelerometer Induced by Micro-fabrication Defects of Micro Folded Beams Cover

Sensitivity Jump of Micro Accelerometer Induced by Micro-fabrication Defects of Micro Folded Beams

Measurement Science Review
Volume 16 (2016): Issue 4 (August 2016)
By: ,  ,  ,   and    
Open Access
|Aug 2016
Authors

Authors

Wu Zhou

zhouwu916@uestc.edu.cn

Lili Chen

Huijun Yu

Bei Peng

Yu Chen

DOI: https://doi.org/10.1515/msr-2016-0028 | Journal eISSN: 1335-8871
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Language: English
Page range: 228 - 234
Submitted on: Jan 3, 2016
Accepted on: Aug 10, 2016
Published on: Aug 19, 2016
Published by: Slovak Academy of Sciences, Institute of Measurement Science
In partnership with: Paradigm Publishing Services
Publication frequency: Volume open
Keywords:
MEMS,
micro accelerometer,
stiffness,
sensitivity,
defect
Related subjects:
Engineering,
Electrical engineering,
Control engineering, metrology and testing

© 2016 Wu Zhou, Lili Chen, Huijun Yu, Bei Peng, Yu Chen, published by Slovak Academy of Sciences, Institute of Measurement Science
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

Volume 16 (2016): Issue 4 (August 2016)
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