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Properties of AlN thin films deposited by means of magnetron sputtering for ISFET applications Cover

Properties of AlN thin films deposited by means of magnetron sputtering for ISFET applications

Open Access
|Jan 2016

Abstract

This work presents the investigations of AlN thin films deposited on Si substrates by means of magnetron sputtering. Nine different sputtering processes were performed. Based on obtained results, the tenth process was prepared and performed (for future ISFET structures manufacturing). Round aluminum (Al) electrodes were evaporated on the top of deposited layers. The MIS capacitor structures enabled a subsequent electrical characterization of the AlN films by means of current-voltage (I-V) and capacitance-voltage (C-V) measurements. Based on these results, the main parameters of investigated layers were obtained. Moreover, the paper describes the technology of fabrication and electrical characterization of ISFET transistors and possibility of their application as ion sensors.

DOI: https://doi.org/10.1515/msp-2015-0095 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
Language: English
Page range: 669 - 676
Submitted on: Jan 13, 2014
Accepted on: Jun 16, 2015
Published on: Jan 6, 2016
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year

© 2016 Piotr Firek, Michał Wáskiewicz, Bartłomiej Stonio, Jan Szmidt, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.