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Growth of intermetallic compound between indium-based thermal interface material and copper substrate: molecular dynamics simulations Cover

Growth of intermetallic compound between indium-based thermal interface material and copper substrate: molecular dynamics simulations

Materials Science-Poland
Volume 33 (2015): Issue 2 (June 2015)
By:  and    
Open Access
|Jul 2015
References

References

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DOI: https://doi.org/10.1515/msp-2015-0054 | Journal eISSN: 2083-134X (formerly 2083-124X) | Journal ISSN: 2083-1331
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Language: English
Page range: 445 - 450
Submitted on: Jan 30, 2014
Accepted on: Feb 27, 2015
Published on: Jul 11, 2015
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Keywords:
thermal interface material (TIM),
molecular dynamics simulations (MD),
diffusivity,
intermetallic compound (IMC)
Related subjects:
Materials sciences,
Materials sciences, other,
Nanomaterials,
Functional and smart materials,
Materials characterization and properties

© 2015 Tomasz Falat, Bartosz Platek, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

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