Plug–and–Produce Integration in Industrial Cyber–Physical Systems based on IEC 61499 and the Module Type Package
By: Dan Huang, Likuan Zhang, Chuanyang Yu, Hui Zhang and Wenbin Dai
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Language: English
Page range: 315 - 327
Submitted on: Jun 30, 2025
Accepted on: Feb 5, 2026
Published on: Jun 20, 2026
Published by: University of Zielona Góra
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
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© 2026 Dan Huang, Likuan Zhang, Chuanyang Yu, Hui Zhang, Wenbin Dai, published by University of Zielona Góra
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