Plug–and–Produce Integration in Industrial Cyber–Physical Systems based on IEC 61499 and the Module Type Package
By: Dan Huang, Likuan Zhang, Chuanyang Yu, Hui Zhang and Wenbin Dai
Authors
Dan Huang
School of Automation and Intelligent Sensing, Shanghai Jiao Tong University, Shanghai, China
Likuan Zhang
Department of Research and Development, Beijing Urban Construction Intelligent Control Co., Ltd, Bldg 4, Beijing, China
Beijing Urban Construction Intelligent Control Joint Lab on Universal Automation, Shanghai Jiao Tong University School of Automation and Intelligent Sensing, Shanghai, China
Chuanyang Yu
Department of Research and Development, Beijing Urban Construction Intelligent Control Co., Ltd, Bldg 4, Beijing, China
Beijing Urban Construction Intelligent Control Joint Lab on Universal Automation, Shanghai Jiao Tong University School of Automation and Intelligent Sensing, Shanghai, China
Hui Zhang
Department of Research and Development, Beijing Urban Construction Intelligent Control Co., Ltd, Bldg 4, Beijing, China
Beijing Urban Construction Intelligent Control Joint Lab on Universal Automation, Shanghai Jiao Tong University School of Automation and Intelligent Sensing, Shanghai, China
Wenbin Dai
School of Automation and Intelligent Sensing, Shanghai Jiao Tong University, Shanghai, China
Beijing Urban Construction Intelligent Control Joint Lab on Universal Automation, Shanghai Jiao Tong University School of Automation and Intelligent Sensing, Shanghai, China
Language: English
Page range: 315 - 327
Submitted on: Jun 30, 2025
Accepted on: Feb 5, 2026
Published on: Jun 20, 2026
Published by: University of Zielona Góra
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
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© 2026 Dan Huang, Likuan Zhang, Chuanyang Yu, Hui Zhang, Wenbin Dai, published by University of Zielona Góra
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.