Thermal decomposition of acrylic pressure-sensitive adhesives Cover

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Thermal decomposition of acrylic pressure-sensitive adhesives

Volume 11 (2009): Issue 4 (December 2009)

By: Zbigniew Czech, Robert Pełech and Krzysztof Zych

Open Access

|Jan 2010

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DOI: https://doi.org/10.2478/v10026-009-0036-8 | Journal eISSN: 3072-0389

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Language: English

Page range: 7 - 12

Published on: Jan 8, 2010

Published by: West Pomeranian University of Technology, Szczecin

In partnership with: Paradigm Publishing Services

Publication frequency: 4 issues per year

Keywords:

acrylic and methacrylic copolymers,

pressure-sensitive adhesives,

thermal degradation products,

analysis and identification

Related subjects:

Industrial chemistry,

Chemical engineering,

Process engineering

© 2010 Zbigniew Czech, Robert Pełech, Krzysztof Zych, published by West Pomeranian University of Technology, Szczecin
This work is licensed under the Creative Commons License.

Volume 11 (2009): Issue 4 (December 2009)