Analysis of electromigration phenomenon in thick-film and LTCC structures at elevated temperature

References

[1] Johnson R., Evans J.L., Jacobsen P., Thompson J.R. Christopher M., IEEE T. Electron. Pa. M., 27 (2004), 164. http://dx.doi.org/10.1109/TEPM.2004.84310910.1109/TEPM.2004.843109
Search in Google Scholar
[2] Neudeck P., Okojie R., Chen L.-Y., P. IEEE, 90 (2002), 1065. http://dx.doi.org/10.1109/JPROC.2002.102157110.1109/JPROC.2002.1021571
Search in Google Scholar
[3] Buttay C. et al., Mat. Sci. Eng. B-Solid, 176 (2011), 283. http://dx.doi.org/10.1016/j.mseb.2010.10.00310.1016/j.mseb.2010.10.003
Search in Google Scholar
[4] Naguib H., Maclaurin B., IEEE T. Compon. Hybr., 2 (1979), 196. http://dx.doi.org/10.1109/TCHMT.1979.113544410.1109/TCHMT.1979.1135444
Search in Google Scholar
[5] Krumbein S.J., IEEE T. Compon. Hybr., 11 (1989), 5. http://dx.doi.org/10.1109/33.295710.1109/33.2957
Search in Google Scholar
[6] Zhang R., Johnson R.W., Vert A., Zhang T., Shaddock D., IEEE T. Compon. Hybr., 2 (2012), 1750. 10.1109/TCPMT.2012.2204995
Search in Google Scholar
[7] Miś E., Borucki M., Dziedzic A., Kamiński S., Wolter K.-J., Sonntag F., ESTC 2006, 954.
Search in Google Scholar
[8] Nowak D., Miś E., Dziedzic A., Kita J., Microelectron. Reliab., 49 (2009), 600. http://dx.doi.org/10.1016/j.microrel.2009.02.01910.1016/j.microrel.2009.02.019
Search in Google Scholar
[9] Orio R., Ceric H., Selberher S., Microelectron. Reliab., 52 (2012), 1981. http://dx.doi.org/10.1016/j.microrel.2012.07.02110.1016/j.microrel.2012.07.021360802823564974
Search in Google Scholar