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Analysis of electromigration phenomenon in thick-film and LTCC structures at elevated temperature Cover

Analysis of electromigration phenomenon in thick-film and LTCC structures at elevated temperature

Materials Science-Poland
Volume 32 (2014): Issue 2 (June 2014)
By: Damian Nowak,  Andrzej Stafiniak and  Andrzej Dziedzic  
Open Access
|Jul 2014

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DOI: https://doi.org/10.2478/s13536-013-0182-9 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
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Language: English
Page range: 247 - 251
Published on: Jul 22, 2014
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
LTCC,
thick-film,
electromigration,
reliability
Related subjects:
Materials sciences,
Materials sciences, other,
Nanomaterials,
Functional and smart materials,
Materials characterization and properties

© 2014 Damian Nowak, Andrzej Stafiniak, Andrzej Dziedzic, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

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