Research of Interaction Between Zn Based Solders and Cu, Al Substrates
By: Michal Prach, Igor Kostolný and Roman Koleňák
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Language: English
Page range: 59 - 65
Published online: Nov 25, 2014
Published in print: Jun 1, 2014
Published by: Slovak University of Technology in Bratislava
In partnership with: Paradigm Publishing Services
Publication frequency: 2 issues per year
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© 2014 Michal Prach, Igor Kostolný, Roman Koleňák, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.