Research of Interaction Between Zn Based Solders and Cu, Al Substrates
By: Michal Prach, Igor Kostolný and Roman Koleňák
DOI: https://doi.org/10.2478/rput-2014-0028 | Journal eISSN: 1338-0532
Language: English
Page range: 59 - 65
Published on: Nov 25, 2014
Published by: Slovak University of Technology in Bratislava
In partnership with: Paradigm Publishing Services
Publication frequency: 2 issues per year
Related subjects:
© 2014 Michal Prach, Igor Kostolný, Roman Koleňák, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.