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Research of Interaction Between Zn Based Solders and Cu, Al Substrates

Research Papers Faculty of Materials Science and Technology Slovak University of Technology
Volume 22 (2014): Issue 34 (June 2014)
By:
Open Access
|Nov 2014

Authors

DOI: https://doi.org/10.2478/rput-2014-0028 | Journal eISSN: 1338-0532
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Language: English
Page range: 59 - 65
Published on: Nov 25, 2014
Published by: Slovak University of Technology in Bratislava
In partnership with: Paradigm Publishing Services
Publication frequency: 2 times per year
Keywords:
zinc solders,
ultrasonic soldering,
copper,
aluminium,
higher application temperatures
Related subjects:
Engineering,
Introductions and overviews,
Engineering, other

© 2014 Michal Prach, Igor Kostolný, Roman Koleňák, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

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