Abstract
Glass as an alternative printed circuit board material and interposer has been investigated for use in the micro-electronics industry. Electroless copper plating is used to provide the conductive layer, but there is limited understanding of how the surface topography of the glass substrate affects the copper/glass bonding strength exhibited in the current literature. A laser ablation technique was used to prepare glass surfaces with micro-scale structured features in this study, and these features were characterized quantitatively using areal surface texture parameters. The copper/glass bonding adhesion strength was quantified using a scratch testing technique, and the relationships between the critical loads measured and the areal surface parameters, as well as discussion of the underlying mechanisms, are presented in this report. Statistical analysis was employed to identify the most relevant areal parameters that may be used for prediction of the copper/glass bonding strength and for design of adhesion promoting surface textures. The experimental results suggest that the most significant areal surface texture parameters to consider are Sq, Sdq, Sdr, Sxp, Vv, Vmc, and Vvc, and the recommended value range for each parameter for optimal plating adhesion performance is given.