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Modelling the Heat and Mass Transfer in Devices with Dense-Layer Dispersed Systems Cover

Modelling the Heat and Mass Transfer in Devices with Dense-Layer Dispersed Systems

Open Access
|Nov 2025
DOI: https://doi.org/10.2478/mspe-2025-0046 | Journal eISSN: 2450-5781 | Journal ISSN: 2299-0461
Language: English
Page range: 470 - 477
Submitted on: Apr 1, 2025
Accepted on: Oct 1, 2025
Published on: Nov 3, 2025
Published by: STE Group sp. z.o.o.
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year

© 2025 Tibor Krenický, Kostiantyn Dyadyura, Olexandr Kokhan, Serhii Umynskyi, published by STE Group sp. z.o.o.
This work is licensed under the Creative Commons Attribution 4.0 License.