Have a personal or library account? Click to login

The microstructures of in-situ synthesized TiC by Ti-CNTs reaction in Cu melts

Materials Science-Poland
Volume 40 (2022): Issue 1 (March 2022)
By:
Open Access
|Jul 2022

Figures & Tables

Fig. 1

The microstructures of the used CNTs (a) Low magnification microstructure; (b) High magnification microstructure. CNTs, carbon nanotubes
The microstructures of the used CNTs (a) Low magnification microstructure; (b) High magnification microstructure. CNTs, carbon nanotubes

Fig. 2

Microstructures of the as-cast Cu-4Ti-1CNTs sample (a, b) Microstructures; (c, d) EDS analysis results of points 1 and 2 shown in (b). CNTs, carbon nanotubes; EDS, energy dispersion spectroscopy
Microstructures of the as-cast Cu-4Ti-1CNTs sample (a, b) Microstructures; (c, d) EDS analysis results of points 1 and 2 shown in (b). CNTs, carbon nanotubes; EDS, energy dispersion spectroscopy

Fig. 3

EDS analysis of the as-cast Cu-4Ti-1C sample (a) SEM image; (b–d) mapping micrographs for the elements C, Cu, and Ti. EDS, energy dispersion spectroscopy; SEM, scanning electron microscopy
EDS analysis of the as-cast Cu-4Ti-1C sample (a) SEM image; (b–d) mapping micrographs for the elements C, Cu, and Ti. EDS, energy dispersion spectroscopy; SEM, scanning electron microscopy

Fig. 4

The XRD results of the powders extracted from (a) Cu-4Ti-1C; (b) Cu-6.67Ti-1C; (c) Cu-4Ti-1C-1Si. XRD, X-ray diffraction analysis
The XRD results of the powders extracted from (a) Cu-4Ti-1C; (b) Cu-6.67Ti-1C; (c) Cu-4Ti-1C-1Si. XRD, X-ray diffraction analysis

Fig. 5

Microstructures of the electrolytic etching Cu-4Ti-1C sample (a) Low magnification microstructure; (b–d) High magnification microstructures of the TiC agglomerations
Microstructures of the electrolytic etching Cu-4Ti-1C sample (a) Low magnification microstructure; (b–d) High magnification microstructures of the TiC agglomerations

Fig. 6

The morphologies of TiC extracted from the Cu-4Ti-1C sample (a, b) The formed TiC shells; (c, d) The agglomerations of TiC; Insert figure in (d): Unreacted CNTs
The morphologies of TiC extracted from the Cu-4Ti-1C sample (a, b) The formed TiC shells; (c, d) The agglomerations of TiC; Insert figure in (d): Unreacted CNTs

Fig. 7

The agglomerations of TiC in Cu-4Ti-1C (a) The synthesized TiC agglomeration with the surface morphology similar to that of the CNTs agglomeration; (b) The formed TiC with a certain aspect ratio. CNTs, carbon nanotubes
The agglomerations of TiC in Cu-4Ti-1C (a) The synthesized TiC agglomeration with the surface morphology similar to that of the CNTs agglomeration; (b) The formed TiC with a certain aspect ratio. CNTs, carbon nanotubes

Fig. 8

Microstructures of the Cu-6.67Ti-1C sample (a, b) as-cast sample; (c, d) electrolytic etching sample
Microstructures of the Cu-6.67Ti-1C sample (a, b) as-cast sample; (c, d) electrolytic etching sample

Fig. 9

EDS analysis of the as-cast Cu-6.67Ti-1C sample (a) SEM image; (b–d) mapping micrographs for the elements C, Cu, and Ti. EDS, energy dispersion spectroscopy; SEM, scanning electron microscopy
EDS analysis of the as-cast Cu-6.67Ti-1C sample (a) SEM image; (b–d) mapping micrographs for the elements C, Cu, and Ti. EDS, energy dispersion spectroscopy; SEM, scanning electron microscopy

Fig. 10

Microstructures of the Cu-4Ti-1C-1Si sample (a, b) as-cast sample; (c, d) electrolytic etching sample
Microstructures of the Cu-4Ti-1C-1Si sample (a, b) as-cast sample; (c, d) electrolytic etching sample

Fig. 11

EDS analysis of the as-cast Cu-4Ti-1C-1Si sample (a) SEM image; (b–e) mapping micrographs for the elements C, Si, Ti, and Cu. (f) EDS point analysis result of point 3 in (a). EDS, energy dispersion spectroscopy; SEM, scanning electron microscopy
EDS analysis of the as-cast Cu-4Ti-1C-1Si sample (a) SEM image; (b–e) mapping micrographs for the elements C, Si, Ti, and Cu. (f) EDS point analysis result of point 3 in (a). EDS, energy dispersion spectroscopy; SEM, scanning electron microscopy

Fig. 12

EDS analysis of the electrolytic etching Cu-4Ti-1C-1Si sample (a) SEM image; (b) EDS point analysis result of point 4 in (a). EDS, energy dispersion spectroscopy; SEM, scanning electron microscopy
EDS analysis of the electrolytic etching Cu-4Ti-1C-1Si sample (a) SEM image; (b) EDS point analysis result of point 4 in (a). EDS, energy dispersion spectroscopy; SEM, scanning electron microscopy

Fig. 13

The volume fraction of TiC in the different composites
The volume fraction of TiC in the different composites

Fig. 14

TiC size distribution statistics (a) Cu-4Ti-1C; (b) Cu-6.67Ti-1C; (c) Cu-4Ti-1C-1Si
TiC size distribution statistics (a) Cu-4Ti-1C; (b) Cu-6.67Ti-1C; (c) Cu-4Ti-1C-1Si

Fig. 15

The properties of the as-cast composites (a) Hardness of the composites; (b) Hardness of Cu matrix; (c) Electrical conductivity
The properties of the as-cast composites (a) Hardness of the composites; (b) Hardness of Cu matrix; (c) Electrical conductivity

Fig. 16

The EDS point analysis result of Cu matrix in the as-cast composites (a) Cu-4Ti-1C; (b) Cu-6.67Ti-1C; (c) Cu-4Ti-1C-1Si. EDS, energy dispersion spectroscopy
The EDS point analysis result of Cu matrix in the as-cast composites (a) Cu-4Ti-1C; (b) Cu-6.67Ti-1C; (c) Cu-4Ti-1C-1Si. EDS, energy dispersion spectroscopy
DOI: https://doi.org/10.2478/msp-2022-0018 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
Journal RSS Feed
Language: English
Page range: 145 - 158
Submitted on: Jan 10, 2022
Accepted on: May 19, 2022
Published on: Jul 13, 2022
Published by: Sciendo
In partnership with: Paradigm Publishing Services
Publication frequency: 4 times per year
Keywords:
Cu matrix composites,
microstructures,
TiC,
CNTs
Related subjects:
Materials sciences,
Materials sciences, other,
Nanomaterials,
Functional and smart materials,
Materials characterization and properties

© 2022 Xuexia Xu, Yong Wang, Qing Wang, Guozhen Dong, Wenbin Li, Guowei Li, YaDong Lv, Jin Zhang, Haimin Ding, published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

Previous articleVolume 40 (2022): Issue 1 (March 2022)