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Comparison of electrical properties of CuO/n-Si contacts with Cu/n-Si Cover

Comparison of electrical properties of CuO/n-Si contacts with Cu/n-Si

Materials Science-Poland
Volume 38 (2020): Issue 3 (September 2020)
By: Reşit Özmenteş and  Cabir Temirci  
Open Access
|Dec 2020

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DOI: https://doi.org/10.2478/msp-2020-0051 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
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Language: English
Page range: 475 - 483
Submitted on: Dec 8, 2018
|
Accepted on: Apr 23, 2019
|
Published on: Dec 12, 2020
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
CuO,
heterojunction,
thermal evaporation,
electrical properties
Related subjects:
Materials sciences,
Materials sciences, other,
Nanomaterials,
Functional and smart materials,
Materials characterization and properties

© 2020 Reşit Özmenteş, Cabir Temirci, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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