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Effect of addition of Cu on the properties of eutectic Sn-Bi solder alloy

Materials Science-Poland
Volume 37 (2019): Issue 2 (June 2019)
By:
Open Access
|Aug 2019

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DOI: https://doi.org/10.2478/msp-2019-0032 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
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Language: English
Page range: 212 - 224
Submitted on: Apr 13, 2018
Accepted on: Jul 18, 2018
Published on: Aug 2, 2019
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 times per year
Keywords:
Sn-Bi-Cu,
lead-free solder alloys,
melting point,
DSC/TGA
Related subjects:
Materials sciences,
Materials sciences, other,
Nanomaterials,
Functional and smart materials,
Materials characterization and properties

© 2019 S.N. Alam, N. Jindal, N. Naithani, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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