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Effect of addition of Cu on the properties of eutectic Sn-Bi solder alloy Cover

Effect of addition of Cu on the properties of eutectic Sn-Bi solder alloy

Materials Science-Poland
Volume 37 (2019): Issue 2 (June 2019)
By: S.N. Alam,  N. Jindal and  N. Naithani  
Open Access
|Aug 2019

Authors

S.N. Alam

nasimulalam@yahoo.com

Department of Metallurgical and Material Engineering, National Institute of Technology Rourkela, Rourkela, India

N. Jindal

Department of Metallurgical and Material Engineering, National Institute of Technology Rourkela, Rourkela, India

N. Naithani

Department of Metallurgical and Material Engineering, National Institute of Technology Rourkela, Rourkela, India
DOI: https://doi.org/10.2478/msp-2019-0032 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
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Language: English
Page range: 212 - 224
Submitted on: Apr 13, 2018
|
Accepted on: Jul 18, 2018
|
Published on: Aug 2, 2019
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
Sn-Bi-Cu,
lead-free solder alloys,
melting point,
DSC/TGA
Related subjects:
Materials sciences,
Materials sciences, other,
Nanomaterials,
Functional and smart materials,
Materials characterization and properties

© 2019 S.N. Alam, N. Jindal, N. Naithani, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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