Effect of addition of Cu on the properties of eutectic Sn-Bi solder alloy
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Authors
S.N. Alam
Department of Metallurgical and Material Engineering, National Institute of Technology Rourkela, Rourkela, India
N. Jindal
Department of Metallurgical and Material Engineering, National Institute of Technology Rourkela, Rourkela, India
N. Naithani
Department of Metallurgical and Material Engineering, National Institute of Technology Rourkela, Rourkela, India
Language: English
Page range: 212 - 224
Submitted on: Apr 13, 2018
Accepted on: Jul 18, 2018
Published on: Aug 2, 2019
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 times per year
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© 2019 S.N. Alam, N. Jindal, N. Naithani, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.