References
- [1] G
uan A., Mo F., Chen P., Geng Y., Chen Q., Zhou L., J. Disp. Technol., 12 (2016), 200. - [2] L
aw T.K., IEEE T. Device Mat. Re., 16 (2016), 576.10.1109/TDMR.2016.2605059 - [3] S
anta C., Roy T., Majumder K., Yadav A., J. Exp. Nanosci., 9 (2014), 776. - [4] M
arkus S., Rosenthal T., Oecklera O., Schnick W., Crit. Rev. Solid State, 39 (2014), 215. - [5] L
iu L., Xie J., Hirosaki N., Takeda T., Zhang C., Li J., Sun X., Sci. Technol. Adv. Mat., 12 (2011), 034404. - [6] S
huai Y., He Y., Tran N.T., Shi F.G., IEEE Photonic. Tech. L., 23 (2011), 137.10.1109/LPT.2010.2092759 - [7] Y
u H., Zi W., Lan S., Zou H., Gan S., Xu X., Hong G., Mater. Res. Innov., 16 (2012), 298.10.1179/1433075X12Y.0000000013 - [8] Q
uoc A.N.D., Lai M.F., Ma H.Y., Lee H.Y., J. Chin. Inst. Eng., 38 (2015), 297. - [9] L
ai M. F., Quoc A.N.D., Ma H.Y., Lee H.Y., J. Chin. Inst. Eng., 39 (2016), 468. - [10] Y
ing S., Shiu A., Appl. Optics, 54 (2015), 28. - [11] L
i C., Rao H., Zhang W., Zhou C., Zhang Q., Zhang K., J. Disp. Technol., 12 (2016), 255. - [12] K
im J.K., Luo H., Schubert E.F., Cho J., Sone C., Park Y., J. Appl. Phys., 44 (2005), 649. - [13] L
uong D., Zhang W., Lee H., J. Alloy. Compd., 509 (2011), 7525. - [14] P
iao X., Horikawa T., Hanzawa H., Machida K., Appl. Phys. Lett., 88 (2006), 219. - [15] H
ayk N., Won H.I., Won C.W., Chem. Commun., 47 (2011), 43. - [16] Z
hang B., Wang J, Hao L., Xu X., Agathopoulos S., Yin L., Wang C., Hintzen H., J. Am. Ceram. Soc., 100 (2016), 257. - [17] Z
hong J., Xie M., Ou Z., Zhang R., Huang M., Zhao F., In Proceedings of Symposium on Photonics and Optoelectronics (2011), Wuhan, 2011, 1. - [18] T
apaninen O., 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Montpellier, 2016.