A new approach to measuring the temperature fields in reflow ovens Cover

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A new approach to measuring the temperature fields in reflow ovens

Journal of Electrical Engineering

Volume 76 (2025): Issue 2 (April 2025)

By: Milan Hurban and Ivan Szendiuch

Open Access

|Apr 2025

Authors

Milan Hurban

Rehm Česká republika s.r.o., Příbor, Czech Republic

Ivan Szendiuch

Brno University of Technology, FEEC, Department of Microelectronics, Brno, Czech Republic

DOI: https://doi.org/10.2478/jee-2025-0019 | Journal eISSN: 1339-309X | Journal ISSN: 1335-3632

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Language: English

Page range: 184 - 189

Submitted on: Jan 30, 2025

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Published on: Apr 10, 2025

Published by: Slovak University of Technology in Bratislava

In partnership with: Paradigm Publishing Services

Publication frequency: 6 issues per year

Keywords:

reflow soldering process,

heat transfer coefficient,

gas flow velocity,

Reynolds number,

temperature field

Related subjects:

Introductions and overviews,

Engineering, other

© 2025 Milan Hurban, Ivan Szendiuch, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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