Abstract
Electronics play an increasingly significant role in our lives. Consequently, the demand for both production volume and quality in electronics is continuously rising. Conveyor reflow ovens are the most widely used technology for soldering electronic assemblies onto printed circuit boards. The implementation of these ovens directly affects the quality of solder joints and, most importantly, the reliability of manufactured electronic assemblies, which are present in virtually all aspects of daily life. The solder joint is formed by the reflow of the solder alloy and is defined by the thermal profile, which represents temperature over time. The most common heating method relies on forced hot air convection, where the printed circuit board with mounted components moves through the oven. One of the key design requirements for these ovens is maintaining a consistent thermal profile to achieve a homogeneous temperature field across the reflow zones. To assess this condition, it is essential to measure convection under operating conditions. A new method for measuring the temperature field directly within the conveyor oven has been developed and experimentally verified during production.