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The influence of current on the structure of the intermetallic compound in solder alloys
By: Josef Skácel and Alexandr Otáhal
Language: English
Page range: 48 - 57
Submitted on: Nov 17, 2024
|Published on: Feb 13, 2025
Published by: Slovak University of Technology in Bratislava
In partnership with: Paradigm Publishing Services
Publication frequency: 6 issues per year
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© 2025 Josef Skácel, Alexandr Otáhal, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.