Authors
Josef Skácel
Department of Microelectronics, Brno University of Technology, Brno, Czech Republic
Alexandr Otáhal
Department of Microelectronics, Brno University of Technology, Brno, Czech Republic
The influence of current on the structure of the intermetallic compound in solder alloys
By: Josef Skácel and Alexandr Otáhal
Language: English
Page range: 48 - 57
Submitted on: Nov 17, 2024
|Published on: Feb 13, 2025
Published by: Slovak University of Technology in Bratislava
In partnership with: Paradigm Publishing Services
Publication frequency: 6 issues per year
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© 2025 Josef Skácel, Alexandr Otáhal, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.