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Delay analysis of mixed CNT bundles as global interconnect for nanotechnology nodes Cover

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Delay analysis of mixed CNT bundles as global interconnect for nanotechnology nodes

Journal of Electrical Engineering

Volume 74 (2023): Issue 1 (February 2023)

By: Gurleen Dhillon and Karmjit Singh Sandha

Open Access

|Mar 2023

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DOI: https://doi.org/10.2478/jee-2023-0007 | Journal eISSN: 1339-309X | Journal ISSN: 1335-3632

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Language: English

Page range: 57 - 63

Submitted on: Jan 21, 2023

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Published on: Mar 7, 2023

Published by: Slovak University of Technology in Bratislava

In partnership with: Paradigm Publishing Services

Publication frequency: 6 issues per year

Keywords:

carbon nanotube (CNT),

single-walled CNT (SWCNT),

multi-walled CNT (MWCNT),

double-walled CNT (DWCNT),

multi-walled and double-wall CNT bundles (MDCB),

multi-walled and single-wall CNT bundles (MSCB),

power-delay product (PDP),

mean-free path (MFP)

Related subjects:

Introductions and overviews,

Engineering, other

© 2023 Gurleen Dhillon, Karmjit Singh Sandha, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

Volume 74 (2023): Issue 1 (February 2023)

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