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Delay analysis of mixed CNT bundles as global interconnect for nanotechnology nodes Cover

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Delay analysis of mixed CNT bundles as global interconnect for nanotechnology nodes

Journal of Electrical Engineering

Volume 74 (2023): Issue 1 (February 2023)

By: Gurleen Dhillon and Karmjit Singh Sandha

Open Access

|Mar 2023

Authors

Gurleen Dhillon

er.gurleendhillon28@gmail.com

Electronics and Communication Engineering Department, Thapar Institute of Engineering and Technology, Patiala, Punjab, India

Karmjit Singh Sandha

Electronics and Communication Engineering Department, Thapar Institute of Engineering and Technology, Patiala, Punjab, India

Articles in this issue

DOI: https://doi.org/10.2478/jee-2023-0007 | Journal eISSN: 1339-309X | Journal ISSN: 1335-3632

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Language: English

Page range: 57 - 63

Submitted on: Jan 21, 2023

|

Published on: Mar 7, 2023

Published by: Slovak University of Technology in Bratislava

In partnership with: Paradigm Publishing Services

Publication frequency: 6 issues per year

Keywords:

carbon nanotube (CNT),

single-walled CNT (SWCNT),

multi-walled CNT (MWCNT),

double-walled CNT (DWCNT),

multi-walled and double-wall CNT bundles (MDCB),

multi-walled and single-wall CNT bundles (MSCB),

power-delay product (PDP),

mean-free path (MFP)

Related subjects:

Introductions and overviews,

Engineering, other

© 2023 Gurleen Dhillon, Karmjit Singh Sandha, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

Volume 74 (2023): Issue 1 (February 2023)

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