Authors
Alexandr Otáhal
Department of Microelectronics, Brno University of Technology, Brno
Ivan Szendiuch
Department of Microelectronics, Brno University of Technology, Brno
Influence of heat flow direction on solder ball interfacial layer
By: Alexandr Otáhal and Ivan Szendiuch
Language: English
Page range: 305 - 310
Submitted on: Jun 26, 2018
|Published on: Sep 19, 2018
Published by: Slovak University of Technology in Bratislava
In partnership with: Paradigm Publishing Services
Publication frequency: 6 issues per year
Keywords:
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© 2018 Alexandr Otáhal, Ivan Szendiuch, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.