Influence of heat flow direction on solder ball interfacial layer
By: Alexandr Otáhal and Ivan Szendiuch
Language: English
Page range: 305 - 310
Submitted on: Jun 26, 2018
|Published on: Sep 19, 2018
Published by: Slovak University of Technology in Bratislava
In partnership with: Paradigm Publishing Services
Publication frequency: 6 issues per year
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© 2018 Alexandr Otáhal, Ivan Szendiuch, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.