References
- Adam J., New Correlations Between Electrical Current and Temperature Rise in PCB Traces, 20th IEEE SEMI-THERM Symposium, (2004).
- Bagnoli P.E., Zhang Y., Electro-thermal simulation of metal interconnections under high current flow, Microelectronics Reliability 50 (2010) 1672-1677.
- Lee T-K., Lee Y-W., Park Y., Kim H-J., Ramakrishna G., Lee S-G., Gothe P., Kim C.- U., Impact of Current induced Joule heating variation on long-term Low melting temperature solder joint stability, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), (2024), 1439-1444.
- Mei J., Haug R., Lanier O., Grözinger T., Zimmermann A., Effect of Joule heating on the reliability of solder joints under power cycling conditions, Microelectronics Reliability 88-90 (2018) 684-690.
- Shankaran G.V., Dogruoz M.B., de Araujo D., Orthotropic thermal conductivity and Joule heating effects on the temperature distribution of printed circuit boards, (2010).
- Yao Y., An Y., Dong J., Wang Y., Tu K.N., Liu Y., Effect of Joule heating on the reliability of microbumps in 3D IC, Journal of Materials Research and Technology 31 (2024) 3374-3382.
- Zhang Y., Bagnoli P.E., A modeling methodology for thermal analysis of the PCB structure, Microelectronics Journal 45 (2014) 1033-1052.
- Zhang Y., Chen L., A modeling method for thermal steady-state simulation of the four-layer printed circuit board, PLoS ONE 19(9): e0310237 (2024).
- Zhang Y., Pennatini A., Bagnoli P.E., A Thermal Model for The PCB Structure Including Thermal Contribution of Traces and Vias, THERMINIC 2012, Budapest, Hungary (2012).