Have a personal or library account? Click to login
Evaluating Joule Heating Effects and Electrical Current Flow Through Copper Layers Inside PCB Using Finite Element Analysis Cover

Evaluating Joule Heating Effects and Electrical Current Flow Through Copper Layers Inside PCB Using Finite Element Analysis

Open Access
|Jul 2025

Download Article

Download the full article as a PDF file.

DOI: https://doi.org/10.2478/bipcm-2025-0014 | Journal eISSN: 2537-4869 | Journal ISSN: 1011-2855
Language: English
Page range: 45 - 59
Submitted on: May 7, 2025
Accepted on: Jun 5, 2025
Published on: Jul 8, 2025
Published by: Gheorghe Asachi Technical University of Iasi
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year

© 2025 George-Gabriel Chiriac, Georgiana Prodan-Chiriac, Cătălin Gabriel Dumitraş, Dragoş-Florin Chitariu, Neculai-Eduard Bumbu, Lucian Oancea, published by Gheorghe Asachi Technical University of Iasi
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.