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Fractional Order, State Space Model of the Temperature Field in the PCB Plate Cover

Fractional Order, State Space Model of the Temperature Field in the PCB Plate

Acta Mechanica et Automatica
Volume 17 (2023): Issue 2 (June 2023)
By: Krzysztof Oprzędkiewicz,  Wojciech Mitkowski and  Maciej Rosół  
Open Access
|Mar 2023

Authors

Krzysztof Oprzędkiewicz

kop@agh.edu.pl

Faculty of Electrical Engineering Automatic Control Informatics and Biomedical Engineering, Department of Automatic Control and Robotics, AGH University of Science and Technology, Kraków, Poland

Wojciech Mitkowski

wojciech.mitkowski@agh.edu.pl

Faculty of Electrical Engineering Automatic Control Informatics and Biomedical Engineering, Department of Automatic Control and Robotics, AGH University of Science and Technology, Kraków, Poland

Maciej Rosół

mr@agh.edu.pl

Faculty of Electrical Engineering Automatic Control Informatics and Biomedical Engineering, Department of Automatic Control and Robotics, AGH University of Science and Technology, Kraków, Poland
DOI: https://doi.org/10.2478/ama-2023-0020 | Journal eISSN: 2300-5319 | Journal ISSN: 1898-4088
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Language: English
Page range: 180 - 187
Submitted on: Jul 9, 2022
Accepted on: Nov 6, 2022
Published on: Mar 19, 2023
Published by: Bialystok University of Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
fractional order systems,
fractional order state equation,
temperature field,
heat transfer,
thermal camera
Related subjects:
Engineering,
Electrical engineering,
Electronics,
Mechanical engineering,
Mechanics,
Bioengineering and biomedical engineering,
Biomechanics,
Civil engineering,
Environmental engineering

© 2023 Krzysztof Oprzędkiewicz, Wojciech Mitkowski, Maciej Rosół, published by Bialystok University of Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

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