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Polymer Conductive Paste Formulation by Modified Ag2O Particles Cover

Polymer Conductive Paste Formulation by Modified Ag2O Particles

Open Access
|May 2024

Authors

Peter Provázek

peter.provazek@tuke.sk

Department of Technologies in Electronics, Faculty of Electrical Engineering and Informatics, Technical University of Košice, Košice, Slovak Republic

Alena Pietriková

Department of Technologies in Electronics, Faculty of Electrical Engineering and Informatics, Technical University of Košice, Košice, Slovak Republic

Peter Lukács

Department of Technologies in Electronics, Faculty of Electrical Engineering and Informatics, Technical University of Košice, Košice, Slovak Republic

Beáta Ballóková

Institute of Materials Research, Slovak Academy of Sciences, Košice, Slovak Republic
DOI: https://doi.org/10.2478/aei-2024-0001 | Journal eISSN: 1338-3957 | Journal ISSN: 1335-8243
Language: English
Page range: 3 - 8
Submitted on: Jan 31, 2024
Accepted on: Feb 19, 2024
Published on: May 30, 2024
Published by: Technical University of Košice
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year

© 2024 Peter Provázek, Alena Pietriková, Peter Lukács, Beáta Ballóková, published by Technical University of Košice
This work is licensed under the Creative Commons Attribution 4.0 License.