Skip to main content
Have a personal or library account? Click to login
FRAMEWORK IMPLEMENTATION, FIRMWARE DEVELOPMENT AND CHARACTERIZATION OF FLEX-SPI COMMUNICATION PROTOCOL: ENERGY CONSUMPTION ANALYSIS AND COMPARISON WITH I2C STANDARD Cover

FRAMEWORK IMPLEMENTATION, FIRMWARE DEVELOPMENT AND CHARACTERIZATION OF FLEX-SPI COMMUNICATION PROTOCOL: ENERGY CONSUMPTION ANALYSIS AND COMPARISON WITH I2C STANDARD

International Journal on Smart Sensing and Intelligent Systems
Volume 10 (2017): Issue 4 (January 2017)
By: ,  ,  ,  ,   and    
Open Access
|Dec 2017
Preview
DOI: https://doi.org/10.21307/ijssis-2018-018 | Journal eISSN: 1178-5608
Journal RSS Feed
Language: English
Page range: 1 - 39
Submitted on: Aug 2, 2017
Accepted on: Aug 15, 2017
Published on: Dec 1, 2017
Published by: International Journal on Smart Sensing and Intelligent Systems
In partnership with: Paradigm Publishing Services
Publication frequency: 1 issue per year
Keywords:
communication protocol,
smart objects,
FlexSPI,
firmware,
energy consumption,
PIC,
I2C
Related subjects:
Engineering,
Introductions and overviews,
Engineering, other

© 2017 P. Visconti, G. Giannotta, R. Brama, P. Primiceri, R. de Fazio, A. Malvasi, published by International Journal on Smart Sensing and Intelligent Systems
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

Volume 10 (2017): Issue 4 (January 2017)
Next article