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FRAMEWORK IMPLEMENTATION, FIRMWARE DEVELOPMENT AND CHARACTERIZATION OF FLEX-SPI COMMUNICATION PROTOCOL: ENERGY CONSUMPTION ANALYSIS AND COMPARISON WITH I2C STANDARD

International Journal on Smart Sensing and Intelligent Systems
Volume 10 (2017): Issue 4 (January 2017)
By:
Open Access
|Dec 2017

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DOI: https://doi.org/10.21307/ijssis-2018-018 | Journal eISSN: 1178-5608
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Language: English
Page range: 1 - 39
Submitted on: Aug 2, 2017
Accepted on: Aug 15, 2017
Published on: Dec 1, 2017
Published by: Professor Subhas Chandra Mukhopadhyay
In partnership with: Paradigm Publishing Services
Publication frequency: 1 times per year
Keywords:
communication protocol,
smart objects,
FlexSPI,
firmware,
energy consumption,
PIC,
IC
Related subjects:
Engineering,
Introductions and overviews,
Engineering, other

© 2017 P. Visconti, G. Giannotta, R. Brama, P. Primiceri, R. de Fazio, A. Malvasi, published by Professor Subhas Chandra Mukhopadhyay
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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