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Thermal Effects in Design of Integrated CMOS MEMS High Resolution Pressure Sensor Cover

Thermal Effects in Design of Integrated CMOS MEMS High Resolution Pressure Sensor

International Journal on Smart Sensing and Intelligent Systems
Volume 2 (2009): Issue 3 (January 2009)
By: ,   and    
Open Access
|Nov 2017
Authors

Authors

C. RoyChaudhuri

chirosreepram@yahoo.com

Department of Electronics and Telecommunication Engg., Bengal Engineering and Science University, Shibpur, India

S.K. Datta

swapandatta50@yahoo.co.in

Department of Physics, City College, Calcutta University, Calcutta, India

H. Saha

sahahiran@gmail.com

Department of Electronics and Telecommunication Engg., Jadavpur University, Jadavpur, India
DOI: https://doi.org/10.21307/ijssis-2017-359 | Journal eISSN: 1178-5608
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Language: English
Page range: 432 - 447
Published on: Nov 3, 2017
Published by: Macquarie University, Australia
In partnership with: Paradigm Publishing Services
Publication frequency: 1 issue per year
Keywords:
Thermal effects,
MEMS piezoresistive pressure sensor,
dynamically linked library,
CMOS MEMS integration
Related subjects:
Engineering,
Introductions and overviews,
Engineering, other

© 2017 C. RoyChaudhuri, S.K. Datta, H. Saha, published by Macquarie University, Australia
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

Volume 2 (2009): Issue 3 (January 2009)
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