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A New Dry Etching Method with the High Etching Rate for Patterning Cross–Linked SU–8 Thick Films
By: Jingning Han, Zhifu Yin, Helin Zou, Wenqiang Wang and Jianbo Feng
Language: English
Page range: 212 - 216
Submitted on: Feb 12, 2016
Published on: Jun 28, 2016
Published by: Slovak University of Technology in Bratislava
In partnership with: Paradigm Publishing Services
Publication frequency: 6 issues per year
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© 2016 Jingning Han, Zhifu Yin, Helin Zou, Wenqiang Wang, Jianbo Feng, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.