Have a personal or library account? Click to login
A New Dry Etching Method with the High Etching Rate for Patterning Cross–Linked SU–8 Thick Films Cover

A New Dry Etching Method with the High Etching Rate for Patterning Cross–Linked SU–8 Thick Films

Journal of Electrical Engineering
Volume 67 (2016): Issue 3 (May 2016)
By: Jingning Han,  Zhifu Yin,  Helin Zou,  Wenqiang Wang and  Jianbo Feng  
Open Access
|Jun 2016

Authors

Jingning Han

Zhifu Yin

Helin Zou

zouhl@dlut.edu.cn

Wenqiang Wang

Jianbo Feng

DOI: https://doi.org/10.1515/jee-2016-0030 | Journal eISSN: 1339-309X | Journal ISSN: 1335-3632
Journal RSS Feed
Language: English
Page range: 212 - 216
Submitted on: Feb 12, 2016
Published on: Jun 28, 2016
Published by: Slovak University of Technology in Bratislava
In partnership with: Paradigm Publishing Services
Publication frequency: 6 issues per year
Keywords:
dry etching,
plasma,
SU-8 photoresist,
etching rate
Related subjects:
Engineering,
Introductions and overviews,
Engineering, other

© 2016 Jingning Han, Zhifu Yin, Helin Zou, Wenqiang Wang, Jianbo Feng, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

Previous articleVolume 67 (2016): Issue 3 (May 2016)Next article