References
- [1] Directive 2011/65/EU of the European Parliament and of the Council on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS), 2011 http://eur-lex.europa.eu/legal-content/EN/TXT/?uri=CELEX:32011L0065.
- [2] Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment (WEEE), 2012, http://eur-lex.europa.eu/legal-content/EN/TXT/?uri=CELEX:32012L0019..
- [3] KUBERSKÝ, P.-SYROVÝ , T.-HAMÁČEK, A-NEŠPŮREK, S.-STEJSKAL, J. : Printed Flexible Gas Sensors based on Organic Materials, Procedia Eng. 120 (2015), 614-617.10.1016/j.proeng.2015.08.746
- [4] MACH, P.-DURAJ, A.-BUŠEK, D.-DUŠEK, K. : Influence of Combined Ageing on Resistance and Noise of Electrically Con- ductive Adhesive Joints, 1st Int. Microelectron. Assem. Packag. Soc. Flash Conf., 2015, pp. 42-43.
- [5] ZHANG, R.-AGAR, J. C.-WONG, C. P. : Recent Advances on Electrically Conductive Adhesives, 12th Electron. Packag. Technol. Conf. no. c, 2010, pp. 696-704.10.1109/EPTC.2010.5702728
- [6] BARTO, S.-CINERT, J.-MACH, P. : Influence of Thermal Aging on the Reliability of Electrically Conductive Adhesives, 2011 IEEE 17th Int. Symp. Des. Technol. Electron. Packag., 2011, pp. 305-308.10.1109/SIITME.2011.6102741
- [7] WICKHAM, M.-ZOU, L.-HUNT, C. : Measuring the Ef- fect of Substrate and Component Finishes on the Reliability of Isotropic Electrically Conductive Adhesive Joints, Solder. Surf. Mt. Technol. 21 No. 4 (Sep 2009), 12-18.10.1108/09540910910989385
- [8] PODZEMSKY, J.-URBANEK, J.-DUSEK, K. : Shear Strength of Joints Made of Lead-Free Solders, in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE), 2011, pp. 84-88.10.1109/ISSE.2011.6053555
- [9] OCKLENBURG, J.-RASTJAGAEV, E.-WILDE, J. : In- vestigation of Modern Electrically Conductive Adhesives for Die-Attachment in Power Electronics Applications, Electron. Components Technol. Conf. (ECTC 2013), 2013, pp. 2189-2195.10.1109/ECTC.2013.6575885
- [10] HIRMAN, M.-STEINER, F. : A Comparison of the Shear Strength of Conductive Adhesives and Soldering Alloys, in Proceedings of the 38th International Spring Seminar on Electronics Technology, 2015.10.1109/ISSE.2015.7247983
- [11] DUSEK, K.-BUSEK, D.-BERAN, T.-RUDAJEVOVA, A. : Comparison of Shear Strength of Soldered SMD Resistors for Various Solder Alloysinbook in the 38th International Spring Seminar on Electronics Technology (ISSE).
- [12] Object Management Group Inc., Methodology Business Process Model and Notation (BPMN 2.0), 2015, http://www.bpmn.org/.
- [13] POPESCU, R.-STAIKOPOULOS, A.-LIU, P.-BROGI, A. -CLARKE, S. : Taxonomy-Driven Adaptation of Multi-layer Applications using Templates, in 2010 Fourth IEEE Interna- tional Conference on Self-Adaptive and Self-Organizing Systems, 2010, pp. 213-222.10.1109/SASO.2010.23
- [14] GU, Y.-JIN, D. : Drop Test Simulation and DOE Analysis for Design Optimization of Microelectronics Packages, Proc. Elec- tron. Components Technol. Conf., vol. 2006, 2006, pp. 422-427.
- [15] KOSIBA, R.-ECKE, G.-LIDAY, J.-BREZA, J.-AMBA- CHER, O. : Auger Depth Profiling and Factor Analysis of Sput- ter Induced Altered Layers in SiC, J. Electr. Eng. 54 No. 01-02 (2003), 52-56.
- [16] LIDAY, J.-CATAROVA, M.-MATUSKOVA, E.-KOSIBA, R.-ECKE, G.-VOGRINCIC, P.-BREZA, J. : Quantitative Aufer Depth Profiling of Ni/C Multilayers by Factor Analysis and Comparison with T-Dyn Simulations, J. Electr. Eng. 52 No. 05-06 (2001), 162-165.
- [17] STEINER, F.-RENDL, K.-WIRTH, V. : Correlation Analy- sis of Wettability, Intermetallic Compound Formation and PCB Contamination, Circuit World 41 No. 2 (May 2015), 70-75.10.1108/CW-10-2014-0047