Shear Strength of Conductive Adhesive Joints on Rigid and Flexible Substrates Depending on Adhesive Quantity

Hirman, Martin; Steiner, Frantisek

doi:10.1515/jee-2016-0025

Abstract

This article deals with the impact of electrically conductive adhesive quantity on the shear strength of joints glued by adhesives “EPO-TEKⓇ H20S” and “MG8331S” on three types of substrates (FR-4, MELINEXⓇST504, DuPont™ PyraluxⓇAC). These joints were made by gluing chip resistors 1206, 0805 and 0603, with two curing profiles for each adhesive. Different thicknesses of stencil and reductions in the size of the hole in stencils were used for this experiment. These differences have an effect on the quantity of conductive adhesives which must be used on the samples. Samples were measured after the curing process by using a shear strength test applied by the device LabTest 3.030. This article presents the effects of different curing profiles, various types of substrates, and different quantities of adhesives on the mechanical strength of the joint.

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Shear Strength of Conductive Adhesive Joints on Rigid and Flexible Substrates Depending on Adhesive Quantity

Abstract

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