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Analysis of Thermal Comfort in an Intelligent Building Cover

Analysis of Thermal Comfort in an Intelligent Building

Open Access
|Jun 2017

Authors

Grzegorz Majewski

majewskigrzegorz@wp.pl

Kielce University of Technology, Kielce, Poland

Marek Telejko

Kielce University of Technology, Kielce, Poland

Łukasz J. Orman

Kielce University of Technology, Kielce, Poland
DOI: https://doi.org/10.1515/cee-2017-0009 | Journal eISSN: 2199-6512 | Journal ISSN: 1336-5835
Language: English
Page range: 72 - 76
Published on: Jun 26, 2017
Published by: University of Žilina
In partnership with: Paradigm Publishing Services
Publication frequency: 2 issues per year

© 2017 Grzegorz Majewski, Marek Telejko, Łukasz J. Orman, published by University of Žilina
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.