A Study on the Influence of Thermal Interface Material in Passively Cooled Electrical Components with Attached Heatsink
Chiriac, George-Gabriel, Dumitraş, Cătălin Gabriel, Mertic, Ionuţ
PCB Copper Traces Stress Due to Thermal Expansion Caused by Joule Heating Effect
Chiriac, George-Gabriel, Prodan-Chiriac, Georgiana, Dumitraş, Cătălin Gabriel, Chitariu, Dragoş-Florin, Bumbu, Neculai-Eduard, Oancea, Lucian
Evaluating Joule Heating Effects and Electrical Current Flow Through Copper Layers Inside PCB Using Finite Element Analysis
Chiriac, George-Gabriel, Prodan-Chiriac, Georgiana, Dumitraş, Cătălin Gabriel, Chitariu, Dragoş-Florin, Bumbu, Neculai-Eduard, Oancea, Lucian