Structured into six chapters, it begins with the fundamentals of epoxy resins, curing agents, and adhesive formulations. Subsequent chapters cover UV cure cationic epoxy chemistry, dual cure hybrid systems combining UV and thermal processes, and snap thermal cure adhesives leveraging latent curing agents. Advanced topics include induction cure epoxy technology with laser and weld bonding applications, as well as snap ambient cure systems for room-temperature bonding.
Readership:
Ideal for researchers, formulating chemists, and engineers in academia and industry.
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