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Techno Economic Analysis of the Use of High Temperature Low Sag (HTLS) Conductors in the Sri Lanka’s Transmission System Cover

Techno Economic Analysis of the Use of High Temperature Low Sag (HTLS) Conductors in the Sri Lanka’s Transmission System

Open Access
|Feb 2017

Abstract

High Temperature Low Sag (HTLS) conductors are introduced with the intention of mitigating some of the disadvantages of the conventional overhead conductors. When compared to conventional conductors, HTLS conductors have better electrical and mechanical characteristics and by using these conductors in overhead transmission lines, some of the complex issues related to power transmissions could be resolved. However, most of the utilities are still in a quandary about using these conductors in place of conventional overhead conductors which have provided a commendable service to them over a period of a century or so. It is because of their lack of experience in using them in the field as well as because of the novel appearance of the conductors. Almost the entire transmission system in Sri Lanka comprises of overhead lines constructed using conventional conductors, especially ACSR conductors. Utility engineers therefore do not have much knowledge on HTLS conductors and also have very little experience in using them. This paper discusses the possibility of adopting the HTLS conductor technology in the Sri Lanka’s transmission system. The properties, behavior and special characteristics as well as the technoeconomic feasibility of using HTLS conductors instead of the conventional conductors are discussed in depth. Lastly, the issues and challenges related to the application of HTLS conductors are discussed. The results of this research will provide valuable information on the possibility of using HTLS conductors in the Sri Lanka’s transmission system.
Language: English
Page range: 41 - 52
Published on: Feb 9, 2017
Published by: The Institution of Engineers, Sri Lanka
In partnership with: Paradigm Publishing Services

© 2017 H. B. D. Yasaranga, W. D. A. S. Wijayapala, K. T. M. U. Hemapala, published by The Institution of Engineers, Sri Lanka
This work is licensed under the Creative Commons License.