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Authors

Tianming Wang

Intelligent Manufacturing Electronics Research Center, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China
School of Integrated Circuits, University of the Chinese Academy of Sciences, Beijing, China

Kaige Wang

Intelligent Manufacturing Electronics Research Center, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China
School of Integrated Circuits, University of the Chinese Academy of Sciences, Beijing, China

Qing Li

liqing@ime.ac.cn

Intelligent Manufacturing Electronics Research Center, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China
School of Integrated Circuits, University of the Chinese Academy of Sciences, Beijing, China
DOI: https://doi.org/10.34768/amcs-2023-0046 | Journal eISSN: 2083-8492 | Journal ISSN: 1641-876X
Language: English
Page range: 651 - 661
Submitted on: Dec 4, 2022
Accepted on: Apr 19, 2023
Published on: Dec 21, 2023
Published by: Sciendo
In partnership with: Paradigm Publishing Services
Publication frequency: 4 times per year

© 2023 Tianming Wang, Kaige Wang, Qing Li, published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.