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Development of Numerical Model and Comparison with the Analytical Model for Predicting the Wire Effects in Wire Electric Discharge Grinding Cover

Development of Numerical Model and Comparison with the Analytical Model for Predicting the Wire Effects in Wire Electric Discharge Grinding

Open Access
|May 2018

Abstract

This paper discusses the development of a numerical model and its comparison with the analytical model to predict the wire deflection in WEDG. The movement of wire between upper and lower guides creates vibration during the machining process which can create micro deflection of the wire. The Finite Element Analysis model [FEA] for the wire deflection is analyzed and compared with the analytical model. The deflection of the wire due to the input current may affect the machining of micro parts, which will be used for further research in micro machining and also will help us to choose the parameters such as current, spark gap, wire feed, and the speed of the workpiece during micro machining with WEDG. The FEA results for various forces were compared with the analytical results and found that the developed numerical model results are in good agreement.

DOI: https://doi.org/10.2478/scjme-2018-0007 | Journal eISSN: 2450-5471 | Journal ISSN: 0039-2472
Language: English
Page range: 69 - 80
Published on: May 17, 2018
Published by: Slovak University of Technology in Bratislava
In partnership with: Paradigm Publishing Services
Publication frequency: 2 issues per year

© 2018 Parthiban Madhavadev, Krishnaraj Vijayan, Senthilkumar Mouleeswaran, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.